Laser marking machine uses laser beam to permanently mark the surface of various materials. The effect of marking is to expose the deep material "engraving" traces through the evaporation of surface material or the chemical and physical changes of surface material caused by light energy, or to burn part of the material through light energy to show the pattern and text to be etched.

There are two recognized working principles:

1. Hot processing: "Hot processing" has a laser beam with high energy density (it is a concentrated energy flow), which is irradiated on the surface of the processed material. The surface of the material absorbs the laser energy and produces a thermal excitation process in the irradiated area, so that the temperature of the surface (or coating) of the material rises, resulting in deformation, melting, ablation, evaporation and other phenomena.

2. Cold processing: "Cold processing" has (ultraviolet) photons with very high load energy, which can cut the chemical bonds in the raw materials (especially organic materials) or the surrounding medium, so that the raw materials are destroyed in a non-thermal process. This kind of cold processing has special significance in the laser marking process, because it is not thermal ablation, but cold peeling that cuts the chemical bonds without the side effect of "thermal damage", so it will not cause heating or thermal deformation to the inner layer and surrounding area of the processed surface. For example, in electronic manufacturing, excimer lasers are used to deposit chemical films on substrate materials and to create narrow grooves on semiconductor silicon wafers.

Laser marking machine application industries:

Widely used in integrated circuit chips, computer accessories, industrial bearings, watches, electronic and communication products, aerospace devices, various auto parts, home appliances, hardware tools, molds, wires and cables, food packaging, jewelry, tobacco, military affairs and many other fields for marking graphics and texts, as well as mass production line operations.